| Other Features | Velour earpads provide amazing comfort and durability.
Magnesium alloy frame results in rigid, thin, lightweight construction.
Tungsten-coated diaphragm provides high rigidity for an improved transient response.
Honeycomb-punched housing design blocks side ventilation to prevent undesirable air pressure loss.
Driver units utilise a pure iron circuit with efficient magnetic characteristics, resulting in precise sound reproduction.
58 mm integrated driver unit design combines diaphragm, voice coil, baffle and magnet in single unit to reduce unwanted vibration.
Proprietary Core Mount Technology places driver unit in optimal position for improved airflow and reduces unnecessary distortion.
Each pair of headphones is meticulously assembled from components built in-house, then rigorously tested before leaving our Tokyo factory.
Fully open-back design allows unrestricted airflow to produce natural bass with no artificial resonance while maintaining pure mid and high frequencies. | Flexible dual- or single-ear usability.
Rain and water splashproof design IPX4*-equivalent.
Ambience control can be employed for music playback and calls.
Truly wireless in-ear headphones with digital hybrid noise-cancelling technology.
Multipoint pairing function allows you to stay connected to two Bluetooth devices at once.
Approximately 6 hours of continuous playback and up to 12.5 hours of extended use with the charger.
Newly designed 5.8 mm high-resolution drivers deliver an extended high-frequency range and improved sound detail.
Dual high-performance MEMS mics, beamforming technology, and Qualcomm® cVc™ Generation 8.0 technology ensure crystal-clear call quality.
Use the touch sensor to choose from five preset noise-cancelling modes or optimized noise cancelling that adapts to your current environment
Compatible with Qualcomm® Snapdragon Sound™, Qualcomm® aptX™ Adaptive audio, and Sony’s 360 Reality Audio to deliver an advanced listening experience. |
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